• 会议内容

首页 > 商务会议 > 学术会议会议 > 2020 IEEE Radio and Wireless Symposium (RWS) 更新时间:2019-09-04T09:37:51

2020 IEEE Radio and Wireless Symposium (RWS)
收藏人
分享到

2020 IEEE Radio and Wireless Symposium (RWS) 已过期

会议时间:2020-01-20 09:00至 2020-01-21 18:00结束

会议地点: 佛罗里达州  详细地址会前通知  None

会议规模:暂无

主办单位: IEEE

行业热销热门关注看了又看 换一换

        会议内容


        会议简介

        RWW2020 will be an international conference covering all aspects of radio and wireless. RWW2020's multidisciplinary events will bring together innovations that are happening across the broad wireless spectrum. RWS2020, this conference application, acts as the main conference for the entire RWW of events that includes the following conferences: PAWR2020, SiRF2020, WiSNet2020, and TWiOS2020 (IEEE Topical Conference on RF/microwave Power Amplifiers, IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, IEEE Topical Conference on Wireless Sensors and Sensor Networks, and IEEE Topical Workshop on the Internet of Space IoS, respectively). In addition to traditional podium presentations and poster sessions, tracks for IEEE Distinguished Lectures, Sunday half-day workshops, Monday panels, and a demo session are planned. A RWW2020 plenary talk are a parallel IoT Summit are planned. A student competition is also planned.

        征稿信息
        重要日期

        初稿截稿日期:2019-07-24

        征稿主题

        1. High-Speed and Broadband Wireless Technologies
        • Broadband Fixed Wireless and Last-Mile Access
        • Ultra-High Data Rate Communications Links - Powerline
        Communication Technologies
        • 3G/4G/5G Wireless Communication Services
        • Ultra-Wideband (UWB) Systems
        • Optical Networks and Systems
        2. Emerging Wireless Technologies and Applications
        • M2M & V2V Technologies & Applications
        • Resource Management, Security
        • Femtocell and Heterogeneous Networks
        • Green, Sustainable Wireless Tech. & Networks
        3. Wireless System Architecture and Modeling
        • Ad Hoc Network Techniques for Internetworking
        • Distributed Network Architectures and Systems
        • Wireless Mesh and Broadband Local/Personal/ Body Area
        Networks
        • Wireless Security and RFID Technologies
        4. Propagation/Channel Modeling and Utilization
        • Propagation/Channel Characterization & Modeling -
        Fading Countermeasures
        • Spectrum Sensing Technologies
        • Frequency and Channel Allocation Algorithms
        5. Digital Signal Processing, SDR, & Cognitive
        Radio
        • Digital/Analog Adaptive/Collaborative Signal Processing
        • Methods for Signal Integrity and Signal Conditioning
        • Interference Mitigation and Cancellation Techniques
        • Software/Hardware architectures, Algorithms
        • MAC, Networking protocols, Policies, Standardization
        • Dynamic Spectrum Sharing, Coexistence, Interoperability
        6. Applications to Bio-medical, Environmental,
        and Internet of Things
        • Miniaturization and Integration of Wireless Technologies
        • Personal Area Networks and Body area Sensor
        Networks
        • Wireless Positioning Technologies & Remote Sensing
        7. MIMO and Multi-Antenna Communications
        • MIMO, MU-MIMO, Space-Time Processing - Relaying
        Technologies
        • Cooperative/Collaborative Technology
        • Multi-Beam Smart Antennas
        8. Antenna Technologies
        • Passive & Active Antennas from RF to THz Frequencies
        • Miniaturized, Multi-frequency and Broadband Antennas
        • Wireless Platform Integrated Antennas
        9. Transceiver & Front-end Technologies,
        SOC & SiP
        • Receiver, Transmitter and Transceiver Components -
        Active Circuits and Sub-systems
        • Multi-Standard Circuits and Sub-systems
        • Low-Power/Low Noise RF/Analog IC and SoC-Chip
        • Highly Integrated Transceivers for Sensing and Imaging
        10. Passive Components & Packaging
        • Discrete, Embedded and Distributed Passive
        Components, Filters, Couplers and Signal Separation
        Devices
        • Discrete and Highly Integrated Packaging
        • 3D-Packaging, Interconnects, and Applications
        • Packaging of MEMs, Biosensors, Organic ICs, etc.
        11. MM-Wave to THz Technology & Applications
        • Device and Circuit Concept & Demonstration
        • Unique Receivers and Transmitters - Integrated Circuits
        • Wireless Links, Arrays & Applications
        12. 3D & Novel Engineered Materials
        • Additive 3D Manufacturing for Wireless Applications
        • Novel Engineered Materials for Antenna, Packaging

        声明:

        1、以上会议非活动家网站主办或承办会议,活动家网站学术会议频道会议信息来自于互联网,方便用户了解行业信息,如需参会、报名、获取会议邀请函或会议日程,请直接与学术会议活动主办单位联系。

        2、部分会议内容来自互联网,由于网络的不确定性,活动家网站对所发布的信息不承担真实性的鉴别工作,请谨慎选择。若您发现会议页面信息有误,请联系活动家客服028-69761252纠错。

        3、欢迎各行业学术会议举办方在活动家网站自行发布学术会议信息,发布活动请点击发布活动

        查看更多

        主办方:IEEE

        温馨提示
        酒店与住宿: 为防止极端情况下活动延期或取消,建议“异地客户”与活动家客服确认参会信息后,再安排出行与住宿。
        退款规则: 活动各项资源需提前采购,购票后不支持退款,可以换人参加。

        部分参会单位

        主办方没有公开参会单位

        邮件提醒通知

        分享到微信 ×

        打开微信,点击底部的“发现”,
        使用“扫一扫”即可将网页分享至朋友圈。

        录入信息

        请录入信息,方便生成邀请函