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首页 > 商务会议 > 其它行业会议 > 2017年第六届信号与图像处理国际学术研讨会( CSIP 2017 ) 更新时间:2017-01-21T16:19:35

2017年第六届信号与图像处理国际学术研讨会( CSIP 2017 )
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2017年第六届信号与图像处理国际学术研讨会( CSIP 2017 ) 已过期

会议时间:2017-03-18 08:00至 2017-03-20 18:00结束

会议地点: 西安  西安华美达兆瑞酒店  莲湖区北大街79号

会议规模:暂无

主办单位: 工程信息研究院

发票类型:增值税普通发票 增值税专用发票

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        会议通知

        大会内容 主办方介绍


        2017年第六届信号与图像处理国际学术研讨会( CSIP 2017 )

        2017年第六届信号与图像处理国际学术研讨会( CSIP 2017 )宣传图

        The 6th Int'l Conference on Signal and Image Processing (CSIP 2017) will be held from March 18 to 20, 2017 in Xi'an, China. This Conference will cover issues on Signal and Image Processing. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.
        CSIP 2017 is devoted to the advancement of signal and image processing. Signal processing is an enabling technology that encompasses the fundamental theory, applications, algorithms, and implementations of processing or transferring information contained in many different physical, symbolic, or abstract formats broadly designated as signals. Image processing is any form of signal processing for which the input is an image, such as a photograph or video frame; the output of image processing may be either an image or a set of characteristics or parameters related to the image. The scope of CSIP 2017 covers both theoretical and practical areas of signal and image processing, and the detailed areas of interest for this Conference are listed in the section of "Call for Abstracts".
        CSIP 2017 will be a valuable and important platform for inspiring international and interdisciplinary exchange at the forefront of signal and image processing. The Conference will bring together academicians, scientists, engineers, and practitioners from all over the world, and we hope that you will take this opportunity to join us for academic exchange and visit the city of Xi'an.
        We look forward to seeing you in Xi'an in March 2017.     

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        工程信息研究院 工程信息研究院

        工程信息研究院,是一个国际学术机构,收集与发布最新的国际学术会议信息,促进学术交流和国际合作,每年与美国电气和电子工程师协会(IEEE)、汤姆逊公司(Thomson)、科学信息研究所(ISI)和美国科研出版社(SRP)等多家知名机构以及全球知名大学和科研机构合作举办国际学术会议。

        会议日程

        (最终日程以会议现场为准)


        Technical Program Committee

        >Prof. Chris Baker
        The Ohio State University, USA

        >Prof. Mingyi He
        Northwestern Polytechnical University, China

        >Dr. Ashish Khare
        University of Allahabad, India

        >Dr. Christophoros Nikou
        University of Ioannina, Greece

        >Dr. Manoranjan Paul
        Charles Sturt University, Australia

        >Prof. Patrick Siarry
        University Paris-Est Créteil (UPEC), France

        >Dr. Rajarshi Gupta
        University of Calcutta, India

        >Prof. Wanyang Dai
        Nanjing University, China

        >Prof. Yong Hu
        The University of Hong Kong, Hong Kong (China)

        >Prof. Yongjie Li
        University of Electronic Science and Technology of China, China 

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        会议嘉宾

        (最终出席嘉宾以会议现场为准)


        电子科技大学教授李永杰

        李永杰

        电子科技大学

        教授

        香港大学教授胡勇

        胡勇

        香港大学

        教授

        南京大学教授戴万阳

        戴万阳

        南京大学

        教授

        University of Calcutta, IndiaDr.Rajarshi Gupta

        Rajarshi Gupta

        University of Calcutta, India

        Dr.

        University Paris-Est Créteil (UPEC), FranceProf.Patrick Siarry

        Patrick Siarry

        University Paris-Est Créteil (UPEC), France

        Prof.

        Charles Sturt University, AustraliaDr.Manoranjan Paul

        Manoranjan Paul

        Charles Sturt University, Australia

        Dr.

        University of Ioannina, GreeceDr.Christophoros Nikou

        Christophoros Nikou

        University of Ioannina, Greece

        Dr.

        University of Allahabad, IndiaDr.Ashish Khare

        Ashish Khare

        University of Allahabad, India

        Dr.

        西北工业大学电子信息学院教授何明一

        何明一

        西北工业大学电子信息学院

        教授

        The Ohio State University, USAProf.Chris Baker

        Chris Baker

        The Ohio State University, USA

        Prof.

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        参会指南

        会议门票 场馆介绍


        Package A: Including Registration Fee + Hotel Fee + Oral Presentation

        Item

        Before March 18, 2017

        Attendee

        USD640/RMB3800


        Package A Includes:

        Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)

        Oral Presentation & A free paper abstract in the Conference Guide

        All Technical Sessions during the whole conference

        Lunch Buffet during the conference(March 19, 20)

        Dinner Buffet during the conference(March 19)

        Coffee Break

        Hotel accommodation for two days includes the breakfast


        Package B: Including Registration Fee + Oral Presentation

        Item

        Before March 18, 2017

        Attendee

        USD450/RMB2700


        Package B Includes:

        Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)

        Oral Presentation & A free paper abstract in the Conference Guide

        All Technical Sessions during the whole conference

        Lunch Buffet during the conference(March 19, 20)

        Dinner Buffet during the conference(March 19)

        Coffee Break


        Package C: Only Registration Fee (No Oral Presentation)

        Item

        Before March 18, 2017

        Attendee

        USD390/RMB2360


        Registration Fee Includes:

        Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)

        All Technical Sessions during the whole conference

        Lunch Buffet during the conference(March 19, 20)

        Dinner Buffet during the conference(March 19)

        Coffee Break

        查看更多

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